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 3.5x2.8 mm SMD CHIP LED LAMP
Part Number: AA3529SYS/L Super Bright Yellow
PRELIMINARY SPEC
Features
SINGLE COLOR. SUITABLE FOR ALL SMT ASSEMBLY AND SOLDER PROCESS. AVAILABLE ON TAPE AND REEL. IDEAL FOR BACKLIGHTING. WHITE SMD PACKAGE, SILICONE RESIN. LOW THERMAL RESISTANCE. PACKAGE: 1500PCS / REEL. MOISTURE SENSITIVITY LEVEL : LEVEL 2a. RoHS COMPLIANT.
Description
The source color devices are made with AlInGaP Light Emitting Diode.
Package Dimensions
Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25(0.01") unless otherwise noted. 3. Specifications are subject to change without notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications.
SPEC NO: DSAH5250 APPROVED: WYNEC
REV NO: V.4 CHECKED: Allen Liu
DATE: JAN/14/2008 DRAWN: R.CHEN
PAGE: 1 OF 6 ERP: 1201002971
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might leads to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Outside impact may scratch the silicone lens or damage the internal circuitry.
4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. 5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production.
SPEC NO: DSAH5250 APPROVED: WYNEC
REV NO: V.4 CHECKED: Allen Liu
DATE: JAN/14/2008 DRAWN: R.CHEN
PAGE: 2 OF 6 ERP: 1201002971
Selection Guide
Part No. Dice Lens Type Iv (mcd) [2] @ 150mA Min. AA3529SYS/L Super Bright Yellow (AlInGaP) WATER CLEAR 1600 Typ. 3000 v (mlm) [2] @ 150mA Min. 3000 Typ. 6000 Viewing Angle [1] 21/2 120
Notes: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. 2. Luminous intensity / luminous flux: +/-15%.
Electrical / Optical Characteristics at TA=25C
Symbol peak D [1] 1/2 C VF [2] IR Parameter Peak Wavelength Dominant Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current Device Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Typ. 590 590 20 20 2.8 3.2 10 Max. Units nm nm nm pF V uA Test Conditions IF=150mA IF=150mA IF=150mA VF=0V;f=1MHz IF=150mA VR=5V
Notes: 1.Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V.
Absolute Maximum Ratings at TA=25C
Parameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating Temperature Storage Temperature
Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Super Bright Yellow 480 150 200 5 -40C To +85C -40C To +85C
Units mW mA mA V
SPEC NO: DSAH5250 APPROVED: WYNEC
REV NO: V.4 CHECKED: Allen Liu
DATE: JAN/14/2008 DRAWN: R.CHEN
PAGE: 3 OF 6 ERP: 1201002971
Super Bright Yellow
AA3529SYS/L
SPEC NO: DSAH5250 APPROVED: WYNEC
REV NO: V.4 CHECKED: Allen Liu
DATE: JAN/14/2008 DRAWN: R.CHEN
PAGE: 4 OF 6 ERP: 1201002971
AA3529SYS/L
Recommended Soldering Pattern (Units : mm; Tolerance: 0.1)
Tape Specifications (Units : mm)
SPEC NO: DSAH5250 APPROVED: WYNEC
REV NO: V.4 CHECKED: Allen Liu
DATE: JAN/14/2008 DRAWN: R.CHEN
PAGE: 5 OF 6 ERP: 1201002971
PACKING & LABEL SPECIFICATIONS
AA3529SYS/L
SPEC NO: DSAH5250 APPROVED: WYNEC
REV NO: V.4 CHECKED: Allen Liu
DATE: JAN/14/2008 DRAWN: R.CHEN
PAGE: 6 OF 6 ERP: 1201002971


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